congatec presents new cooling solutions for 100 Watt edge server ecosystem
This is a submission from congatec on three cooling solutions for the new 100 Watt edge server ecosystem that is being built around AMD EPYCTM Embedded 3000 Series Processors. With rugged cooling solutions and processor modules for 24/7 operation from a single source, OEMs no longer need to think about how to design in a processor waste heat management system.
congatec – a leading vendor of standardized and customized embedded computer boards and modules – presents three cooling solutions for the new 100 Watt edge server ecosystem that is being built around AMD EPYCTM Embedded 3000 Series Processors. With rugged cooling solutions and processor modules for 24/7 operation from a single source, OEMs no longer need to think about how to design in a processor waste heat management system. In fact, recommendations for system ventilation design are also often included, so that the thermal design effort at the system level is significantly reduced. Perfectly matched cooling solutions are essential for the 100 Watt edge server ecosystem, as overheating can lead to rapid aging and system failure. Edge servers with real-time requirements also need optimum protection against thermally induced performance degradation to ensure deterministic behavior, which further underscores the importance of high-performance cooling systems in industrial computer systems.
“The AMD EPYC Embedded 3000 Series Processors provide a new level of high-performance computing for embedded edge server systems. But with such embedded system designs, it is critical to manage the thermal envelope of any high-performance part. That’s why we’ve worked hard to create a 100 Watt ecosystem for high-performance COM Express modules that meets the rugged design requirements for 24/7 operation. We are now presenting three of these solutions for the first time at Embedded World 2020,” explains Andreas Bergbauer, Product Line Manager at congatec.
“The AMD EPYC Embedded 3000 Series Processors allow for a wide range of embedded edge server designs. It is great to see that companies such as congatec invest in offering a complete ecosystem with Server-on-Modules and all required accessories, such as these powerful cooling solutions, which will help simplify designs and help end customers get systems faster,” explains Stephen Turnbull, director of product management and business development, Embedded Solutions, AMD.
The congatec cooling solutions for the 100 watt ecosystem around the AMD EPYC Embedded 3000 Series Processors come in three variants, all based on the COM Express heatspreader specification that has been standardized by the PICMG, i.e. heatspreader with heatpipe adapter; heatspreader with integrated heatpipe; and an active cooling solution. Together with standard COM Express heatspreaders, OEMs can now choose between four variants that cover the entire range of processor cooling solutions.
“The AMD EPYC Embedded 3000 Series Processors provide a new level of high-performance computing for embedded edge server systems. But with such embedded system designs, it is critical to manage the thermal envelope of any high-performance part. That’s why we’ve worked hard to create a 100 Watt ecosystem for high-performance COM Express modules that meets the rugged design requirements for 24/7 operation. We are now presenting three of these solutions for the first time at Embedded World 2020,” explains Andreas Bergbauer, Product Line Manager at congatec.
“The AMD EPYC Embedded 3000 Series Processors allow for a wide range of embedded edge server designs. It is great to see that companies such as congatec invest in offering a complete ecosystem with Server-on-Modules and all required accessories, such as these powerful cooling solutions, which will help simplify designs and help end customers get systems faster,” explains Stephen Turnbull, director of product management and business development, Embedded Solutions, AMD.
The congatec cooling solutions for the 100 watt ecosystem around the AMD EPYC Embedded 3000 Series Processors come in three variants, all based on the COM Express heatspreader specification that has been standardized by the PICMG, i.e. heatspreader with heatpipe adapter; heatspreader with integrated heatpipe; and an active cooling solution. Together with standard COM Express heatspreaders, OEMs can now choose between four variants that cover the entire range of processor cooling solutions.
