congatec to solve ruggedization challenges of edge server and client designs
This is a submission from congatec on their extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC.
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC
congatec – a leading vendor of embedded and edge computing technology – focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The solution portfolio for COM-HPC server modules is particularly impressive, tackling the fact that a significantly higher TDP must be mastered for these edge computing platforms, which represents a challenging task especially in the extended temperature range.
The driving force behind this focus is the increasing demand for rugged edge and real-time fog computing technologies to facilitate digitization projects in often extremely harsh and challenging environments. Typical use cases for these ultra-durable platforms can be found in critical railway, road traffic and smart city infrastructures, offshore rigs and wind parks, electricity distribution networks, piping systems for the oil, gas and freshwater industries, telecom and broadcasting networks, as well as distributed surveillance and security systems. Further target markets include network connected industrial and medical devices with IIoT / Industry 4.0 connectivity, outdoor kiosk and digital signage systems and, not to forget, in-vehicle applications such as autonomous logistic vehicles.
The new platforms for harsh environments presented by congatec support extreme temperature ranges from -40°C to +85°C, feature BGA soldered processors for shock and vibration as well as high EMI resistance, and can optionally be made available with conformal coating to protect the platforms against ingress from condensation, salt water and dust.
congatec – a leading vendor of embedded and edge computing technology – focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The solution portfolio for COM-HPC server modules is particularly impressive, tackling the fact that a significantly higher TDP must be mastered for these edge computing platforms, which represents a challenging task especially in the extended temperature range.
The driving force behind this focus is the increasing demand for rugged edge and real-time fog computing technologies to facilitate digitization projects in often extremely harsh and challenging environments. Typical use cases for these ultra-durable platforms can be found in critical railway, road traffic and smart city infrastructures, offshore rigs and wind parks, electricity distribution networks, piping systems for the oil, gas and freshwater industries, telecom and broadcasting networks, as well as distributed surveillance and security systems. Further target markets include network connected industrial and medical devices with IIoT / Industry 4.0 connectivity, outdoor kiosk and digital signage systems and, not to forget, in-vehicle applications such as autonomous logistic vehicles.
The new platforms for harsh environments presented by congatec support extreme temperature ranges from -40°C to +85°C, feature BGA soldered processors for shock and vibration as well as high EMI resistance, and can optionally be made available with conformal coating to protect the platforms against ingress from condensation, salt water and dust.
