Qualcomm and TDK sign 3-billion dollar deal, launch RF360 Holdings
In an attempt to prepare itself for 5G and IoT Qualcomm has signed a 3-billion dollar joint-venture agreement with TDK. The new company, RF360 Holdings, will provide a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) to support the wide range of frequency bands being deployed in wireless communication networks.
In an attempt to prepare itself for 5G and IoT Qualcomm has signed a 3-billion dollar joint-venture agreement with TDK. The new company, RF360 Holdings, will provide a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) to support the wide range of frequency bands being deployed in wireless communication networks.
TDK will bring its micro-acoustic RF filtering, packaging and module integration know-how to the deal, completing Qualcomm’s current RF360 portfolio of power amplifiers, antenna switches, antenna matching tuners, and envelope trackers.
Qualcomm will own 51 percent of the Singapore-based joint venture and TDK, through its Epcos subsidiary, will own 49 percent. Qualcomm has 30 months to buy out TDK’s stake.
TDK will bring its micro-acoustic RF filtering, packaging and module integration know-how to the deal, completing Qualcomm’s current RF360 portfolio of power amplifiers, antenna switches, antenna matching tuners, and envelope trackers.
Qualcomm will own 51 percent of the Singapore-based joint venture and TDK, through its Epcos subsidiary, will own 49 percent. Qualcomm has 30 months to buy out TDK’s stake.
