Aiming at the growing trend of server and IPC high-speed applications, Apacer is the first to introduce a full range of DDR4-3200 servers and industrial-grade DRAM modules to fully support these latest Intel Cascade Lake and AMD “Rome”  high-end server processor platforms.

Due to the high demand for data processing and transmission in the 5G era, the need for data centers, servers, edge computing devices and AI applications to provide reliable high-speed solutions is greater than ever. Intel’s Cascade Lake and Ice Lake which target high-end and AI applications, along with AMD’s 2nd generation EPYC Rome, Ryzen 3000 and Ryzen Embedded V1000 series have led to support for 2933 MT/s and even 3200 MT/s DRAM modules. Recognizing this business opportunity, Apacer put its R&D team into overdrive and developed DDR4-3200 DRAM modules to work in sync with these new processors.  

Cindy Huang, director of Apacer’s Vertical Market Application Division, pointed out, “from the sales side, the shipments of Apacer’s server memory modules in 2018 were still dominated by DDR4-2400. But as of the first half of 2019, DDR4-2666 shipments exceeded DDR4-2400, so it is not difficult to see the strong demand for high-performance memory in the server market. Apacer's full range of DDR4-3200 industrial-grade DRAM modules supports speeds up to 3200 MT/s, and the performance is currently the best in the market. In the second half of 2019, the market demand for high-performance memory products is expected to gradually shift to DDR4-2933, and, among certain forward-looking market segments, even DDR4-3200.”

Server operations and industrial computing often operate 24/7. Apacer’s DDR4-2933 and -3200 DRAM incorporates major-grade original DRAM ICs, long-term stable supplies and fixed components (Fixed B.O.M.) as advantages. Apacer also offers patented anti-sulfuration DRAM modules, ideal for protecting edge computing devices operating in polluted environments. Apacer’s DDR4-2933 and -3200 industrial-grade memory is available in UDIMM, SODIMM, RDIMM, ECC UDIMM and ECC SODIMM configurations, and capacities of 8GB and 16GB are both available. Samples should be delivered in Q4 of 2019, and by Q1 of 2020, products will enter mass production and begin shipping.