congatec to focus on embedded edge computing at Embedded World
The new Intel RFP Ready Kit for real time workload consolidation that congatec has compiled together with Intel and Real-Time Systems enables OEMs to directly start with the development next generation of vision-based collaborative robotics, automation controls and autonomous vehicles that have to tackle multiple tasks in parallel, including situational awareness utilizing deep learning based AI algorithms. The RFP Ready Kit utilizes the RTS Hypervisor from Real-Time Systems on congatec’s COM Express Type 6 based Intel® Xeon® E2 industrial application server platform and comes ready to order with everything designers need.
In cooperation with Basler and Hacarus, congatec will also be presenting application ready vision and AI development kits. The MIPI-CSI 2 Smart Camera Kit for vision systems at the edge integrates all hardware and software components that OEMs need for the development of embedded vision-based applications. A special highlight is the SMARC carrier board, featuring flat-foil connectors for the direct connection of Basler’s MIPI cameras.
The AI Development Kit, which is offered in cooperation with Hacarus, allows developers to directly evaluate the advantages of sparse modeling based AI. The kit integrates an AI system based on the highly scalable and powerful congatec Qseven modules with Intel ‘Apollo Lake’ processors. Thanks to sparse modeling it is possible – for the first time – to perform AI training tasks on the edge in addition to inference algorithms. This opens up completely new application areas for machine learning.
Innovative cooling solutions for the development of ultra-high-performance edge servers, designed for use in harsh environments away from air-conditioned data centers, complete the congatec showcase. Such powerful cooling is needed to allow users to take advantage of the full performance of the 16-core COM Express Type 7 modules with 3 GHz dual-die AMD EPYC Embedded 3000 processors.
With such a wide range from the low-power to the high end, and from modules to complete development kits, all user groups will benefit from stopping by at the congatec booth. So, come and visit congatec at Embedded World in Hall 1, Booth 358.
Further information on congatec’s Embedded World showcase can be found at: https://www.congatec.com/ew2020
In cooperation with Basler and Hacarus, congatec will also be presenting application ready vision and AI development kits. The MIPI-CSI 2 Smart Camera Kit for vision systems at the edge integrates all hardware and software components that OEMs need for the development of embedded vision-based applications. A special highlight is the SMARC carrier board, featuring flat-foil connectors for the direct connection of Basler’s MIPI cameras.
The AI Development Kit, which is offered in cooperation with Hacarus, allows developers to directly evaluate the advantages of sparse modeling based AI. The kit integrates an AI system based on the highly scalable and powerful congatec Qseven modules with Intel ‘Apollo Lake’ processors. Thanks to sparse modeling it is possible – for the first time – to perform AI training tasks on the edge in addition to inference algorithms. This opens up completely new application areas for machine learning.
Innovative cooling solutions for the development of ultra-high-performance edge servers, designed for use in harsh environments away from air-conditioned data centers, complete the congatec showcase. Such powerful cooling is needed to allow users to take advantage of the full performance of the 16-core COM Express Type 7 modules with 3 GHz dual-die AMD EPYC Embedded 3000 processors.
With such a wide range from the low-power to the high end, and from modules to complete development kits, all user groups will benefit from stopping by at the congatec booth. So, come and visit congatec at Embedded World in Hall 1, Booth 358.
Further information on congatec’s Embedded World showcase can be found at: https://www.congatec.com/ew2020
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