From February 25th to 27th 2020 in Nuremberg, during embedded world exhibition & conference, SECO will showcase its latest solutions to the tens of thousands of expected visitors at its booth 1-330.

At embedded world 2020 in Germany, SECO will be proud to announce the expansion of its Qseven® standard products portfolio. As a proven NXP partner, as well as a leading-edge Arm® partner, SECO has developed the μQ7-C72, a new solution based on the combination of high scalability performance, low power consumption and good price/performance.    

The μQ7-C72 comes with NXP’s i.MX 8M Mini and i.MX 8M Nano families of processors, completing SECO’s already rich portfolio of products based on the i.MX 8 Family, which ranges from the i.MX 8M Mini to the i.MX 8 Quad Max.

“Our partnership with NXP is such that we chose to invest in developing solutions based on every NXP platform” states Gianluca Venere, SVP Strategy and Business Development at SECO. “Starting from those based on the RT family, looking to expand the portfolio of the SENSE product line – characterized by smart sensors for the Industrial IoT – by using Cortex-M-powered MPUs with inference accelerators. Finally getting to the high-end Layerscape family, to complete our product range with edge server and solutions dedicated to automotive and any other application field requiring Functional Safety”.

The μQ7-C72 is a Qseven® standard module designed for next-generation embedded systems. In addition to being a μQseven® form factor, the most compact and cost-effective Computer-On-Module in the embedded market, this solution is available with up to 4 core Cortex®-A53 based NXP i.MX 8M Mini and i.MX 8M Nano processors (respectively up to 1.8 GHz and 1.5 GHz). This ensures high performance at low power levels, full-HD resolution and 3D graphics, and an extended temperature support from -30°C to +85°C. 

This COM is well equipped with 4 USB 2.0 host ports in the i.MX 8M Nano version and 5 USB 2.0 host ports in the i.MX 8M Mini version.  It comes with optional Wi-Fi + Bluetooth 5.0 module, Gigabit Ethernet interface, Single/Dual Channel 18/24-bit LVDS interface or eDP interface, 8x GPIOs, SM BUS and I2C interface. Focusing on graphic performance, the μQ7-C72 integrates Vivante GC320 2D accelerator + GC NanoUltra 3D accelerator (with i.MX 8M Mini processors) or Vivante GC7000UL 2D/3D GPU (with i.MX 8M Nano processors). Finally, the memory consists of a soldered-on board DDR4-2400, with 32-bit interface in the i.MX 8M Mini version and 16-bit in the i.MX 8M Nano, up to a maximum of 4GB. 

The μQ7-C72 is a great solution for several fields of application, including multimedia devices, vending machines and HMI.

i.MX 8M Mini Applications Processors represent NXP’s latest video and audio experience, combining state-of-the-art media-specific features and high-performance processing. Additionally, it is optimized for low-power consumption. This family of processors is based on a multi-core processing architecture (quad Arm® Cortex®-A53 core plus a general-purpose Cortex®-M4 400 MHz core processor for low-power processing), providing more speed and improved power efficiency.

Featuring up to 4x Arm® Cortex®-A53 cores and 1x general purpose Arm® Cortex®-M7 core, the i.MX 8M Nano Application Processors provide cost-effective integration and affordable performance for smart, connected, power-efficient devices requiring graphics, vision, voice control, intelligent sensing and general-purpose processing.

By expanding its product portfolio with this new solution, SECO proves once again its ability to keep up with latest market demands, providing solutions for the newest applications. SECO’s focus, in fact, is to always provide the best solution for its customers’ needs, merging efficiency, cutting-edge technology, and professional support.  
           
SECO looks forward to welcoming the visitors at embedded world, booth 1-330, to discover its wide portfolio of products based on latest technologies as well as its innovative solutions for the Industrial IoT domain.