| This is a submission from Rutronik on the Panasonic HCI (Host Controlled Interface) Bluetooth RF module PAN1326C2. It's based on Texas Instr...
Rutronik Elektronische Bauelemente GmbH (65)
| This is a submission from Rutronik on their global distribution agreement with Laser Components GmbH. Laser Components’ product range includ...
| This is a submission from Rutronik on the wideband RF diversity switches BGS14WMA9 and BGS12WN6 with high switching speed and optimized for...
| This is a submission from Rutronik about the launch of Infineon’s new XENSIV™ TLI4971, a coreless open loop current sensor for accurate and...
| This is a submission from Rutronik Elektronische Bauelemente GmbH. Rutronik has continued its series of successes in Elektronik magazine’s r...
| This is a submission from Rutronik about Minew’s new MS88SF2 multi-protocol module. This module is based on the SoC (System-on-Chip) nRF5284...
| Rutronik Elektronische Bauelemente GmbH and AP Memory Technology Corp. have entered into a global distribution agreement. The agreement enco...
| This is a submission from Rutronik on the compact wireless transceiver module TCM 515. This module is suitable for systems such as transceiv...
| This is a submission from Rutronik on the new Nordic Semiconductor multi-sensor IoT prototyping kit Nordic Thingy:91 for IoT applications. W...
| This is a submission from Rutronik Elektronische Bauelemente GmbH. They have entered into a global distribution agreement with the Taiwanes...