Multi-Layer Pcbs

48 What are buried and blind vias? The idea of creating buried and blind vias comes from the manufacturing of the printed-circuit board. A multi-layer board is built from a set of (thin) double-sided boards. The copper layers of these thin boards form the copper layers of a multi- layer board. They are all etched and then stacked together, separated by insulation layers. This is the lamination process il- lustrated in Fig. 1. lize the resulting board and complete the rest of the lamination process - see Fig. 3. the drilling hole will cross and select the drill diameter accordingly. If the designer wants to extend 1st order buried vias to a higher order, the drill diameter may need to be changed.To be able to manufacture the board, the PCB manufacturer needs to have a drill file for each layer-pair and each half-product that has buried vias. Finally, a drill file for the complete board is needed for the through- the-board vias and component pins. The 10-layer board of Fig. 4 need...