World premiere for x86 based COM-HPC Server
February 25, 2022
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congatec – a leading vendor of embedded and edge computing technology – celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.
The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads in rugged environments and extended temperature ranges. Improvements include up to 20 cores, RAM to up to 1 TB, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100 GbE connectivity and TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures – such as smart grids for oil, gas and electricity as well as rail and communication networks – and also includes vision enabled applications such as autonomous vehicles and video infrastructures for safety and security.
Besides the huge bandwidth and performance improvements, congatec’s three new Server-on-Module families will significantly extend the lifecycle of next-gen rugged edge server designs compared to common servers as long-term availability of up to ten years is planned. The module families further convince with a comprehensive server-grade feature set: For mission critical designs, they offer powerful hardware security features including Intel Boot Guard, Intel Total Memory Encryption – Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX). AI applications benefit from built-in hardware acceleration including AVX-512 and VNNI. For best RAS capabilities, the processor modules integrate the Intel Resource Director Technology (Intel RDT) and support remote hardware management features such as IPMI and redfish.
The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads in rugged environments and extended temperature ranges. Improvements include up to 20 cores, RAM to up to 1 TB, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100 GbE connectivity and TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures – such as smart grids for oil, gas and electricity as well as rail and communication networks – and also includes vision enabled applications such as autonomous vehicles and video infrastructures for safety and security.
Milestone
“The launch of our massive workload accelerating Intel Xeon D processor based COM-HPC Server-on-Modules is a milestone for the various edge server industries in three respects,” explains Martin Danzer, Director of Product Management at congatec. “First, Intel Xeon D processor based Server-on-Modules now target not only standard industrial environments but also outdoor and in-vehicle applications due to the extended temperature range support. Second, the worldwide first x86 COM-HPC Server-on-Modules extend the available number of cores for the first time to 20 and with up to 8 RAM sockets enable massively more memory bandwidth, which is essential for server workloads. Third, these server modules have real-time capabilities both with respect to the processor cores and TCC/TSN enabled real-time Ethernet. This is a combination that many OEMs have been eagerly waiting for.”Besides the huge bandwidth and performance improvements, congatec’s three new Server-on-Module families will significantly extend the lifecycle of next-gen rugged edge server designs compared to common servers as long-term availability of up to ten years is planned. The module families further convince with a comprehensive server-grade feature set: For mission critical designs, they offer powerful hardware security features including Intel Boot Guard, Intel Total Memory Encryption – Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX). AI applications benefit from built-in hardware acceleration including AVX-512 and VNNI. For best RAS capabilities, the processor modules integrate the Intel Resource Director Technology (Intel RDT) and support remote hardware management features such as IPMI and redfish.
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