| [Partner Content] congatec introduces new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vi...
| [Partner Content] congatec introduces new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vi...
| [Partner Content] Are you looking for a partner experienced in working with semiconductor companies to support your software developments? O...
| The new edition of Elektor Industry magazine (1/2021) focuses on embedded systems, microcontrollers and tools. Check out this special editio...
| This article introduces the origin and development of the RISC-V ISA. It briefly describes the technical characteristics and selection guide...
| This is submission from SECO. The company is enriching their lineup with the latest member in the i.MX 8 Series: the i.MX 8M Plus applicatio...
| This is a submission from SECO on its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: t...
| In the August 2020 edition of Elektor Industry magazine ("Embedded Technology and Tools"), we look at the impact of COVID-19 for professiona...
| This is a submission from congatec on its brand new conga-SMC1/SMARC-x86 3.5-inch carrier board. The new size-optimized SMARC 2.1 carrier bo...
| Struggling to stay on top of all the electronics news ? Elektor has you covered. Here's a brief update on embedded dev, the IC market, and...
| This is a submission from Microchip Technology Inc. Continuing to execute upon its core strategy of delivering smart, connected and secure s...