| [Partner Content] Micro-pitch connectors suitable for IIoT modules and embedded computing.
| [Partner Content] Micro-pitch connectors suitable for IIoT modules and embedded computing.
| Starting in 2005 as a small engineering office in Aachen, Germany, Loetronic has made a name for itself with its own audio modules (keyword:...
| [partner content] New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future.
| [Partner Content] congatec introduces new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vi...
| [Partner Content] Are you looking for a partner experienced in working with semiconductor companies to support your software developments? O...
| The new edition of Elektor Industry magazine (1/2021) focuses on embedded systems, microcontrollers and tools. Check out this special editio...
| This article introduces the origin and development of the RISC-V ISA. It briefly describes the technical characteristics and selection guide...
| This is submission from SECO. The company is enriching their lineup with the latest member in the i.MX 8 Series: the i.MX 8M Plus applicatio...
| This is a submission from SECO on its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: t...
| In the August 2020 edition of Elektor Industry magazine ("Embedded Technology and Tools"), we look at the impact of COVID-19 for professiona...