| [Partner Content] 3.3 kV SiC MOSFETs and Schottky Barrier Diodes (SBDs) extend designers’ options for high-voltage power electronics in tran...
| [Partner Content] 3.3 kV SiC MOSFETs and Schottky Barrier Diodes (SBDs) extend designers’ options for high-voltage power electronics in tran...
| [Partner Content] New SL1302A Test Case Package enables interoperability tests based on charging standard GB/T 34657.1
| [Partner Content] Join the Edge ML Series, exclusive invite-only events for key leaders on the journey to deploying edge ML solutions into p...
| [Partner Content] Apacer has taken 3D NAND Flash optimization to new heights. Today, it announces the release of SLC-liteX industrial SSDs t...
| [Partner Content] The Flashtec® NVMe 4016 controller enables unparalleled performance and a rich ‘cloud-ready’ feature set including industr...
| [Partner Content] Xilinx SmartLynq+ Module is intended for high-speed debug and trace, primarily targeting designs using the Versal™ platfor...
| [Partner Content] congatec introduces three new Server-on-Module families with Intel Xeon D processors.
| [Partner Content] Nine Hungarian startups were participating in the Elektor Fast Forward Award (FFA) in 2020 and 2021. Three of them finishe...
| [Partner Content] 6G is expected to be built on technologies such as artificial intelligence (AI), sensing, digital twins, time-sensitive ne...
| [Partner Content] congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by PICMG with the launch of a fully specificat...