| This is a submission from SECO on its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: t...
| This is a submission from SECO on its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: t...
| In the August 2020 edition of Elektor Industry magazine ("Embedded Technology and Tools"), we look at the impact of COVID-19 for professiona...
| This is a submission from congatec on its brand new conga-SMC1/SMARC-x86 3.5-inch carrier board. The new size-optimized SMARC 2.1 carrier bo...
| This is a submission from Microchip Technology Inc. Continuing to execute upon its core strategy of delivering smart, connected and secure s...
| This is a submission from congatec. They're expanding their embedded vision offering with a new solution platform for the NXP i.MX 8 process...
| This is a submission from Lattice Semiconductor. The company extended its position as a global provider of FPGA-based embedded vision soluti...
| This is a submission from SECO on the SENSE-D01, their newest microcontroller for industrial applications. SENSE-D01 is SECO’s enfant terrib...
| This is a submission from SECO on EDGEHOG, their IIoT-as-a-service platform that leverages SECO’s multidisciplinary expertise in electronics...
| This is a submission from Apacer Technology. They will once again participate in the Embedded World trade show in Nuremberg, Germany. In res...
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